S. Venkatesan, James Lee, S. Goh, B. Pile, Daniel Meerovich, J. Mo, Yang Jing, Lucas Soldano, Baochang Xu, Yu Zhang, A. Thean, Yeow Kheng Lim
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引用次数: 4
Abstract
In this paper, we present a unique hybrid integration platform for wafer scale passive assembly of electronics and photonics devices using a CMOS based Optical Interposer. Our optical interposer enables seamless communications between electronics and photonics chips that are assembled on it using visually assisted passive flip chip bonding techniques. This unique integration platform is the first such platform in the industry adapted to directly modulated lasers and enables the world’s smallest single chip Transmit/Receive Optical engine for 100G-400G optical engines.
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