{"title":"Multi-physical simulation of high performance computing platform integrating polymer waveguides","authors":"T. Bechtold, D. Hohlfeld","doi":"10.1109/EUROSIME.2016.7463327","DOIUrl":null,"url":null,"abstract":"This work presents a general simulation approach for all relevant physical effects in electro-optical circuit boards. Such printed circuit boards integrate electrical components and connections together with optical wave-guides as signal lines for applications in data transmission and sensing. The proposed modelling approach includes a calculation of heat distribution based on convective cooling and the thermally induced mechanical stress. We also present results on mode shapes within straight and uniformly curved waveguides as well as a consideration of ray tracing.","PeriodicalId":438097,"journal":{"name":"2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"22 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-04-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EUROSIME.2016.7463327","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
This work presents a general simulation approach for all relevant physical effects in electro-optical circuit boards. Such printed circuit boards integrate electrical components and connections together with optical wave-guides as signal lines for applications in data transmission and sensing. The proposed modelling approach includes a calculation of heat distribution based on convective cooling and the thermally induced mechanical stress. We also present results on mode shapes within straight and uniformly curved waveguides as well as a consideration of ray tracing.
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