Boundary-scan adoption - an industry snapshot with emphasis on the semiconductor industry

Abstract

Increasing circuit densities and speeds are quickly reducing electrical test point access for printed circuit assembly test. Boundary-scan (JTAG/IEEE 1149.x) is a technology that will allow continued testability of printed circuit assemblies, but its use requires that it be designed into semiconductor devices. Currently, not all semiconductor suppliers support boundary-scan. Wider availability of complying devices is necessary to enable cost-efficient and effective board test for future designs. This paper presents the results of a boundary-scan survey developed by the International Electronics Manufacturing Initiative (iNEMI). The survey was intended to gauge the current adoption rate of boundary-scan, identify any impediments to widespread use, and select areas for future research.