R. Rímolo-Donadío, C. Baks, B. Lee, J. H. Song, X. Gu, Y. Kwark, D. Kuchta, A. Rylyakov, C. Schow
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引用次数: 1
Abstract
This paper discusses the requirements and challenges associated with the design of electrical interconnects to support the test and evaluation of high-speed transceivers working up to 40 Gb/s. It will be shown that relatively low cost technologies such as FR-4 boards, push-on connectors, and wire bonding can effectively achieve this goal. A specific platform and its application for testing of a 40-Gb/s VCSEL-based optoelectronic link are presented.