Frequency- and time-domain stochastic analysis of lossy and dispersive interconnects in a SPICE-like environment

Paolo Manfredi, D. Ginste, D. Zutter, F. Canavero
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引用次数: 1

Abstract

This paper presents an improvement of the state-of-the-art polynomial chaos (PC) modeling of high-speed interconnects with parameter uncertainties via SPICE-like tools. While the previous model, due to its mathematical formulation, was limited to lossless lines, the introduction of modified classes of polynomials yields a formulation that allows to account for lossess and dispersion as well. Thanks to this, the new implementation can also take full advantage of the combination of the PC technique with macromodels that accurately describe the interconnect properties. An application example, i.e. the stochastic analysis of an on-chip line, validates and demonstrates the improved method.
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类spice环境中损耗和色散互连的频域和时域随机分析
本文利用SPICE-like工具,对具有参数不确定性的高速互连的最先进的多项式混沌(PC)建模进行了改进。而之前的模型,由于其数学公式,仅限于无损线,改进的多项式类的引入产生了一个公式,允许考虑损失和分散。因此,新的实现还可以充分利用PC技术与精确描述互连特性的宏模型的结合。一个应用实例,即片上线的随机分析,验证和证明了改进的方法。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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