Crosstalk analysis in CMOS integrated circuits

J. Novak, J. Foit
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引用次数: 1

Abstract

The ICs in LSI technology require multilayer connecting-lead systems employing large leads density, diminishing the physical distance between individual leads. The small lead-to-lead separation results increased crosstalk effects inside the integrated circuits. A method was designed to facilitate the forecast of crosstalks in integrated circuits using simple passive LCR circuit models of connecting lines. It appears possible, given a well defined standard interconnecting technology, to forecast the maximum value of crosstalk in a digital system regardless of the physical length of the mutually interfering leads. This presents a major design advantage since the maximum crossialk value can be determined using simple equations without any need to pe form circuit simulations of digital systems including the influence of parasitic couplings. The application of these limit cases can speed up considerably the design of electromagnetically compatible electronic systems.
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CMOS集成电路中的串扰分析
大规模集成电路技术中的集成电路需要采用大引线密度的多层连接引线系统,从而减小单个引线之间的物理距离。较小的引线间距增加了集成电路内部的串扰效应。设计了一种利用简单的无源LCR连接线路模型预测集成电路串扰的方法。给定一个定义良好的标准互连技术,无论相互干扰引线的物理长度如何,都可以预测数字系统中串扰的最大值。这提出了一个主要的设计优势,因为最大串扰值可以使用简单的方程来确定,而不需要对包括寄生耦合影响的数字系统进行电路模拟。这些极限情况的应用可以大大加快电磁兼容电子系统的设计速度。
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