X. Long, C. Du, Wenbin Tang, Yongchao Liu, Yao Yao, Fengrui Jia
{"title":"Constitutive Behaviour of Single Lap Joint of Sintered Silver Paste","authors":"X. Long, C. Du, Wenbin Tang, Yongchao Liu, Yao Yao, Fengrui Jia","doi":"10.1109/EPTC.2018.8654407","DOIUrl":null,"url":null,"abstract":"Due to scale effect, sintered silver nanoparticles (AgNP) own the most appealing advantage of low temperature sintering and high temperature service. Compared with other solder materials, sintered AgNP has superior high thermal and electrical conductivities, which benefits the application of packaging structures subjected to high current density in advanced electronic devices. This study quantifies the mechanical properties of sintered AgNP using single lap joint specimens, which were prepared with an overlapped area of 2.0 mm $\\times2.0$ mm and mechanically tested to obtain the shear load-displacement responses under different shear strain rates ranging from $10 ^{-3} /\\mathrm{s}$ to $5 \\times 10 ^{-2} /$s. The failure occurred within the sintered AgNP rather than the interface between AgNP and Au coating.","PeriodicalId":360239,"journal":{"name":"2018 IEEE 20th Electronics Packaging Technology Conference (EPTC)","volume":"11 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 IEEE 20th Electronics Packaging Technology Conference (EPTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPTC.2018.8654407","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
Due to scale effect, sintered silver nanoparticles (AgNP) own the most appealing advantage of low temperature sintering and high temperature service. Compared with other solder materials, sintered AgNP has superior high thermal and electrical conductivities, which benefits the application of packaging structures subjected to high current density in advanced electronic devices. This study quantifies the mechanical properties of sintered AgNP using single lap joint specimens, which were prepared with an overlapped area of 2.0 mm $\times2.0$ mm and mechanically tested to obtain the shear load-displacement responses under different shear strain rates ranging from $10 ^{-3} /\mathrm{s}$ to $5 \times 10 ^{-2} /$s. The failure occurred within the sintered AgNP rather than the interface between AgNP and Au coating.
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