Rectification failure in GaAs MESFETs subjected to single pulses of intense microwave radiation

J. McAdoo, W. M. Bollen, R. Seeley, W. Catoe, J. Frey
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引用次数: 3

Abstract

An important mechanism for damage to GaAs microwave integrated circuits from single pulses of intense microwave radiation has been observed by the use of high-speed photography and optical and RF spectroscopy. This mechanism is named rectification failure because it transforms the Schottky junctions of the transistors to ohmic resistors. High-speed photography was used to clock the emission of optical radiation after the arrival of the high-power microwave pulse, optical spectroscopy was employed to determine the source of the optical emissions, and RF spectroscopy was applied to monitor the generation of harmonics of the incident radiation as a function of time during each test pulse. Devices tested included packaged low-noise amplifiers and power amplifiers. The tests proceeded by the direct injection of a single pulse of microwave radiation into the input port of the device. The pulses typically lasted for 100 ns. Testing would start at power levels too low to inflict damage and would proceed with successively higher power pulses until damage was observed. Devices were tested both with and without bias voltages applied. The results of the testing are presented.<>
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强微波单脉冲作用下GaAs mesfet的整流失效
利用高速摄影技术、光学和射频光谱技术,研究了单脉冲强微波辐射对砷化镓微波集成电路损伤的重要机理。这种机制被称为整流失效,因为它将晶体管的肖特基结转变为欧姆电阻。采用高速摄影技术对高功率微波脉冲到达后的光辐射发射进行计时,采用光谱学技术确定光发射源,并采用射频光谱技术监测每个测试脉冲期间入射辐射谐波的产生与时间的关系。测试的器件包括封装的低噪声放大器和功率放大器。测试是通过将单脉冲微波辐射直接注入设备的输入端口来进行的。脉冲通常持续100纳秒。测试将从功率水平过低而不会造成损害的情况开始,并将持续使用更高功率的脉冲,直到观察到损害。在施加偏置电压和不施加偏置电压的情况下对器件进行了测试。最后给出了试验结果。
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Multifunction chip set for T/R module receive path Monolithic Ka band VCO using quarter micron GaAs MESFETs and integrated high-Q varactors A single chip 2.20 GHz T/R module 5-100 GHz InP CPW MMIC 7-section distributed amplifier A high power 2-18 GHz T/R switch
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