Single crystal silicon rotational micromotors

K. Suzuki, H. Tanigawa
{"title":"Single crystal silicon rotational micromotors","authors":"K. Suzuki, H. Tanigawa","doi":"10.1109/MEMSYS.1991.114762","DOIUrl":null,"url":null,"abstract":"Three types of rotational micromotors, stepping, harmonic, and gyro-like side-drives, are presented. The rotors, poles, and stators are made of a thick single crystal silicon layer by using boron-diffused silicon etch stop to define the thickness and using anisotropic dry etching to form narrow and deep separation gaps. The rotor stoppers are fabricated by polysilicon trench filling and sacrificial layer etching processes. The silicon chips are electrostatically bonded onto glass chips, followed by unmasked wafer dissolution, freeing the rotors so that they can move. The novel process successfully provided micromotors with a 50 mu m diameter rotor.<<ETX>>","PeriodicalId":258054,"journal":{"name":"[1991] Proceedings. IEEE Micro Electro Mechanical Systems","volume":"11 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1991-01-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"23","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"[1991] Proceedings. IEEE Micro Electro Mechanical Systems","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MEMSYS.1991.114762","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 23

Abstract

Three types of rotational micromotors, stepping, harmonic, and gyro-like side-drives, are presented. The rotors, poles, and stators are made of a thick single crystal silicon layer by using boron-diffused silicon etch stop to define the thickness and using anisotropic dry etching to form narrow and deep separation gaps. The rotor stoppers are fabricated by polysilicon trench filling and sacrificial layer etching processes. The silicon chips are electrostatically bonded onto glass chips, followed by unmasked wafer dissolution, freeing the rotors so that they can move. The novel process successfully provided micromotors with a 50 mu m diameter rotor.<>
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
单晶硅旋转微电机
介绍了三种类型的旋转微电机,步进、谐波和类陀螺侧驱动。转子、极、定子由一层较厚的单晶硅层构成,采用硼扩散硅蚀刻片确定厚度,采用各向异性干蚀刻形成窄而深的分离间隙。采用多晶硅沟槽填充和牺牲层蚀刻工艺制备转子止动器。硅晶片被静电粘合在玻璃晶片上,接着晶片被溶解,释放转子,使它们可以移动。该新工艺成功地为微电机提供了直径为50 μ m的转子。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Fabrication of micro-structures using non-planar lithography (NPL) In situ observation and analysis of wet etching process for micro electro-mechanical systems Silicon wafer bonding techniques for assembly of micromechanical elements Microtribology related to MEMS-Concept, measurements, applications Characteristics of an ultra-small biomotor
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1