{"title":"Thermal modelling of the Pentium processor package","authors":"H. Rosten, R. Viswanath","doi":"10.1109/ECTC.1994.367556","DOIUrl":null,"url":null,"abstract":"Large mono-chip packages show a trend of increasing power dissipation and power density: for example the maximum dissipation of the Pentium processor is 16 Watts compared to the 6 Watts of its 80486 predecessor. This poses challenges for equipment designers to provide satisfactory thermal environments for reliable package operation. This paper provides an example of a component manufacturer and a thermal-analysis software vendor working together to construct and validate a thermal model of first-level packaging of a die (the Pentium processor) that can be used by equipment designers concerned with second- and third-level packaging. It is proposed that this example might set a pattern for the future.<<ETX>>","PeriodicalId":344532,"journal":{"name":"1994 Proceedings. 44th Electronic Components and Technology Conference","volume":"3 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1994-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"35","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"1994 Proceedings. 44th Electronic Components and Technology Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.1994.367556","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 35
Abstract
Large mono-chip packages show a trend of increasing power dissipation and power density: for example the maximum dissipation of the Pentium processor is 16 Watts compared to the 6 Watts of its 80486 predecessor. This poses challenges for equipment designers to provide satisfactory thermal environments for reliable package operation. This paper provides an example of a component manufacturer and a thermal-analysis software vendor working together to construct and validate a thermal model of first-level packaging of a die (the Pentium processor) that can be used by equipment designers concerned with second- and third-level packaging. It is proposed that this example might set a pattern for the future.<>
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