{"title":"Improved layer assignment for packaging multichip modules","authors":"C.-H. Chen, M.H. Heydari, I. Tollis, C. Xia","doi":"10.1109/DFTVS.1992.224343","DOIUrl":null,"url":null,"abstract":"The layer assignment problem plays an important role in packaging multichip modules, since the number of layers is directly related to the cost of the final product. In this paper, the authors propose a new model for the problem and a heuristic layer assignment algorithm based on the new model. The experimental results presented show that the solution provided by the algorithm is close to the lower bound.<<ETX>>","PeriodicalId":319218,"journal":{"name":"Proceedings 1992 IEEE International Workshop on Defect and Fault Tolerance in VLSI Systems","volume":"51 4 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1992-11-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings 1992 IEEE International Workshop on Defect and Fault Tolerance in VLSI Systems","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/DFTVS.1992.224343","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
The layer assignment problem plays an important role in packaging multichip modules, since the number of layers is directly related to the cost of the final product. In this paper, the authors propose a new model for the problem and a heuristic layer assignment algorithm based on the new model. The experimental results presented show that the solution provided by the algorithm is close to the lower bound.<>
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