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Proceedings 1992 IEEE International Workshop on Defect and Fault Tolerance in VLSI Systems最新文献

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Comparing results from defect-tolerant yield models 比较耐缺陷良率模型的结果
C. Thibeault, Y. Savaria
To date, many models have been developed to predict the yield of defect-tolerant integrated circuits (ICs). In this paper, results obtained from several of these models are compared. Their sensitivity to various model parameters is also examined. These results lead one to conclude that, despite differences in the predicted amount of redundancy, it may be possible to obtain good solutions. The differences in the solutions come from the models as well as from the parameters used in these models, and solutions are said to be good when the resulting figures of merit are rather insensitive. Consequently, a simple method is proposed to select the number of spares to add in defect-tolerant ICs.<>
迄今为止,已经开发了许多模型来预测耐缺陷集成电路(ic)的成品率。本文对几种模型的计算结果进行了比较。研究了它们对各种模型参数的敏感性。这些结果使人们得出这样的结论:尽管在预测的冗余量上存在差异,但有可能获得好的解决方案。解决方案中的差异来自模型以及这些模型中使用的参数,当所得的价值数字相当不敏感时,解决方案被认为是好的。因此,提出了一种简单的方法来选择在容错集成电路中添加的备件数量。
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引用次数: 0
Bridging faults modeling and detection in CMOS combinational gates CMOS组合门的桥接故障建模与检测
G. Buonanno, D. Sciuto
A method based on the detectability of bridging faults through test sets developed to locate other types of faults is presented. In particular it will be shown how bridging faults can be detected in CMOS combinational circuits using a test procedure that detects transistor stuck-at faults in a new design for testability for fully CMOS logic. The detection of more than 95% of the possible bridging faults (single and multiple) is achieved.<>
提出了一种基于桥接故障可检测性的测试集故障定位方法。特别是,它将展示如何在CMOS组合电路中使用测试程序检测桥接故障,该测试程序检测晶体管卡在故障的新设计,以实现完全CMOS逻辑的可测试性。实现了95%以上的可能桥接故障(单个和多个)的检测
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引用次数: 1
Tolerance of delay faults 延迟故障容忍度
D. Walker
Defect tolerance is traditionally concerned with maintaining system function in the face of spot defects that cause catastrophic circuit faults, such as shorts and opens. This paper describes the problem of spot defects that cause delay faults, and how they can be modeled and characterized in an IC fabrication line. A procedure for simulating the occurrence of such delay faults in a design is described, and results for a number of examples are given. Some techniques for tolerance of delay faults at the architectural and algorithmic level are described.<>
缺陷容忍度传统上关注的是在面对导致灾难性电路故障(如短路和开路)的点缺陷时保持系统功能。本文描述了引起延迟故障的点缺陷问题,以及如何在集成电路生产线中对其进行建模和表征。本文描述了在设计中模拟此类延迟故障发生的过程,并给出了一些实例的结果。从体系结构和算法两个层面对延迟容错技术进行了描述。
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引用次数: 13
A universal self-test design for chip, card and system 一种通用的芯片、卡和系统自检设计
D.M. Wu, R. Doney
Describes an implementation of chip built-in self-test using by-pass boundary scan design. This basic structure is then modified to implement a universal self-test structure for cards, boxes and systems.<>
介绍一种采用旁通边界扫描设计的芯片内置自检实现。然后对这个基本结构进行修改,以实现卡片、盒子和系统的通用自检结构
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引用次数: 0
Probabilistic analysis of memory reconfiguration in the presence of coupling faults 存在耦合故障时存储器重构的概率分析
C. Low, H. Leong
The problem of reconfiguring memory arrays using spare rows and spare columns has received a great deal of attention in recent years. However, most of the existing research assumes that the array contains only stuck-at faults. This paper, addresses the problem of reconfiguring memory arrays containing both stuck-at faults and coupling faults. The authors present a probabilistic model for studying this problem which is known to be NP-complete. In this model, they distinguish between two classes of faults, namely the class of stuck-at faults and the class of coupling faults. All faulty cells in an array are assumed to independently distributed. The authors first present a bound on the probabilities of occurrence of these two classes of faults that will allow almost all problem instances to be reparable. They also present a bound on these probabilities of defects that will make reconfiguration almost impossible. Empirical study is carried out to validate theoretical results and to investigate the nature of problem instances with probabilities of defects that do not fall within the theoretical bounds.<>
近年来,利用备用行和备用列重新配置内存阵列的问题受到了广泛的关注。然而,现有的大多数研究都假设该阵列只包含卡住的故障。本文讨论了同时包含卡滞故障和耦合故障的存储器阵列的重构问题。作者提出了研究这一问题的概率模型,该模型已知是np完全的。在该模型中,他们区分了两类故障,即卡滞故障和耦合故障。假设阵列中所有故障单元独立分布。作者首先给出了这两类故障发生概率的界限,该界限允许几乎所有的问题实例都是可修复的。它们也给出了缺陷概率的一个边界,使得重构几乎是不可能的。进行实证研究以验证理论结果,并调查具有不落在理论范围内的缺陷概率的问题实例的性质
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引用次数: 6
Arithmetic codes for concurrent error detection in artificial neural networks: the case of AN+B codes 人工神经网络并发错误检测的算术码:以AN+B码为例
V. Piuri, M. Sami, R. Stefanelli
A number of digital implementations of neural networks have been presented in recent literature. Moreover, several authors have dealt with the problem of fault tolerance; whether such aim is achieved by techniques typical of the neural computation (e.g. by repeated learning) or by architecture-specific solutions, the first basic step consists clearly in diagnosing the faulty elements. The present paper suggests adoption of concurrent error detection; the granularity chosen to identify faults is that of the neuron. An approach based on a class of arithmetic codes is suggested; various different solutions are discussed, and their relative performances and costs are evaluated. To check the validity of the approach, its application is examined with reference to multi-layered feed-forward networks.<>
在最近的文献中提出了许多神经网络的数字实现。此外,一些作者已经处理了容错问题;无论这样的目标是通过典型的神经计算技术(例如通过重复学习)还是通过特定架构的解决方案来实现,第一个基本步骤显然包括诊断故障元素。本文建议采用并发错误检测;选择用于识别故障的粒度是神经元的粒度。提出了一种基于一类算术编码的方法;讨论了各种不同的解决方案,并对其相对性能和成本进行了评估。为了验证该方法的有效性,以多层前馈网络为例对其应用进行了检验
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引用次数: 18
Nondeterministic adaptive routing techniques for WSI processor arrays WSI处理器阵列的不确定性自适应路由技术
D. Blight, R. McLeod
Presents new adaptive routing algorithms for faulty processor arrays. Past research has shown that packet switched based communication performance in mesh connected networks is significantly degraded by the presence of faulty processors. Nondeterministic routing algorithms have been developed based on transport modeling of packet flow in disordered arrays. By utilizing nondeterministic routing strategies, based on biased random walkers, one can implement deadlock free routing, at the expense of not following the shortest path. These algorithms will be shown to be capable of increasing network bandwidth in the presence of faulty processors and interconnects. These algorithms offer an alternative to conventional adaptive routing techniques by utilizing a computationally simple algorithm based on local (nearest neighbor) information. Although the authors concentrate efforts on 2-dimensional processor arrays, the algorithms are also suitable for higher dimensional topologies such as hypercubes.<>
提出了一种针对故障处理器阵列的自适应路由算法。过去的研究表明,在网状连接网络中,由于故障处理器的存在,基于分组交换的通信性能会显著降低。基于无序阵列中数据包流的传输建模,提出了不确定性路由算法。通过利用基于有偏差随机行走器的不确定性路由策略,可以实现无死锁路由,但代价是不遵循最短路径。这些算法将被证明能够在存在故障处理器和互连的情况下增加网络带宽。这些算法通过利用基于本地(最近邻)信息的计算简单算法,提供了传统自适应路由技术的替代方案。虽然作者将精力集中在二维处理器阵列上,但该算法也适用于高维拓扑,如超立方体。
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引用次数: 4
Spatial fault simulation and the saturation effect 空间断层模拟与饱和效应
C. Stapper
Stochastic fault simulation processes have been used successfully to generate fault distributions for evaluating fault tolerant VLSI designs. In one of these processes, faults in subareas of integrated circuits are simulated as a function of time. This leads to an exponential increase of the average number of faults in the area segments of the integrated circuits. It was discovered analytically that by forcing a correlation between the number of faults in adjacent area segments, the increase in the number of faults with time exceeds exponential growth and exhibits a singularity. At the singularity point the fault population becomes infinite. The time associated with this singularity has been denoted as 'saturation time'.<>
随机故障模拟过程已成功地用于生成故障分布,以评估VLSI设计的容错性。在其中一个过程中,集成电路子区域的故障被模拟为时间的函数。这导致集成电路区域段的平均故障数量呈指数增长。通过分析发现,通过强迫相邻区域段断层数之间的相关性,断层数随时间的增长超过指数增长,并表现出奇点。在奇点处,故障数变为无穷大。与这个奇点有关的时间被记为“饱和时间”。
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引用次数: 0
Scan-based testability for fault-tolerant architectures 容错架构的基于扫描的可测试性
A. DeHon
The acceptance and use of standard scan-based test access ports (TAPs), such as the IEEE-1149.1-1990 standard, have begun to ease the task of system testability and in-circuit diagnostics. The typical singular nature of these TAPs along with the all-or-nothing manner in which test facilities are accessed make such standard TAPs inappropriate for use in fault-tolerant architectures. The authors propose three simple additions to standard scan practices which allow scan techniques to be effectively utilized in fault-tolerant environments. Specifically, they advocate the incorporation of multiple-TAPs, port-by-port selection control, and partial external scan. Multi-TAP construction offers tolerance to faults in the scan path or circuitry. Port-by-port selection and partial external scan allow fault-diagnostics which are minimally intrusive and in-operation reconfiguration for fault-masking and repair.<>
接受和使用标准的基于扫描的测试访问端口(tap),如IEEE-1149.1-1990标准,已经开始减轻系统可测试性和在线诊断的任务。这些tap的典型的单一性质,以及访问测试设施的全有或全无的方式,使得这些标准tap不适合在容错架构中使用。作者对标准扫描实践提出了三个简单的补充,使扫描技术能够在容错环境中得到有效利用。具体地说,他们提倡合并多个tap,端口对端口选择控制和部分外部扫描。多tap结构提供了对扫描路径或电路故障的容忍度。逐端口选择和部分外部扫描允许故障诊断,这是最小的侵入和在操作中重新配置故障屏蔽和修复。
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引用次数: 4
Modeling of 3-dimensional defects in integrated circuits 集成电路三维缺陷的建模
J. P. de Gyvez, S. Dani
Although the majority of defects found in manufacturing lines have predominantly 2-Dimensional effects, there are many situations in which 2D defect models do not suffice, e.g. tall layer bulks disrupting the continuity of subsequent layers, abrupt surface topologies, extraneous materials embedded in the IC, etc. In this paper, a procedure to capture the catastrophic effect of 3-Dimensional defects is presented. This approach is based on the geometrical properties that result from the interaction between IC and defect size in two coordinate spaces: x-y and z. The approach is a natural extension to the concept of critical areas, namely, the extraction of critical volumes. Through the course of this work hints to the origins of 3D defects will be given, conditions to capture critical volumes will be developed, and it will be shown that the net effect of 3D defects is accumulated from layer to layer.<>
尽管在生产线上发现的大多数缺陷主要具有二维效应,但在许多情况下,二维缺陷模型是不够的,例如,高层体破坏后续层的连续性,突然的表面拓扑结构,嵌入集成电路的外来材料等。本文提出了一种捕捉三维缺陷灾难性效应的方法。该方法基于两个坐标空间(x-y和z)中IC和缺陷尺寸之间相互作用产生的几何特性。该方法是对关键区域概念的自然扩展,即提取临界体积。通过本工作的过程,将给出3D缺陷起源的提示,将开发捕获临界体积的条件,并将表明3D缺陷的净效应是逐层累积的。
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引用次数: 4
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Proceedings 1992 IEEE International Workshop on Defect and Fault Tolerance in VLSI Systems
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