700V PIC technology based on 0.35µm design for AC-DC power units

T. Karino, O. Sasaki, M. Yamaji, H. Sumida
{"title":"700V PIC technology based on 0.35µm design for AC-DC power units","authors":"T. Karino, O. Sasaki, M. Yamaji, H. Sumida","doi":"10.1109/ISPSD.2012.6229060","DOIUrl":null,"url":null,"abstract":"We have established the 700V-class PIC technology based on 0.35μm design to provide power management ICs with higher performances and lower chip cost for the first time. And a 700V PWM-IC based on 0.35μm design, whose chip size can be reduced to 50% that of the IC based on 1.0μm design, is realized. This paper will report our developed 700V PIC technology with a PWM-IC product designed by this technology.","PeriodicalId":371298,"journal":{"name":"2012 24th International Symposium on Power Semiconductor Devices and ICs","volume":"22 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2012-06-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 24th International Symposium on Power Semiconductor Devices and ICs","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISPSD.2012.6229060","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 6

Abstract

We have established the 700V-class PIC technology based on 0.35μm design to provide power management ICs with higher performances and lower chip cost for the first time. And a 700V PWM-IC based on 0.35μm design, whose chip size can be reduced to 50% that of the IC based on 1.0μm design, is realized. This paper will report our developed 700V PIC technology with a PWM-IC product designed by this technology.
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基于0.35µm的700V PIC技术设计的交直流电源单元
我们建立了基于0.35μm设计的700v级PIC技术,首次提供更高性能和更低芯片成本的电源管理ic。实现了基于0.35μm设计的700V pwm集成电路,其芯片尺寸比基于1.0μm设计的集成电路减小了50%。本文将介绍我们开发的700V PIC技术以及采用该技术设计的pwm集成电路产品。
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Vertical leakage/breakdown mechanisms in AlGaN/GaN-on-Si structures Advanced 0.13um smart power technology from 7V to 70V Failure mechanisms of low-voltage trench power MOSFETs under repetitive avalanche conditions Destruction behavior of power diodes beyond the SOA limit Clamped inductive turn-off failure in high-voltage NPT-IGBTs under overloading conditions
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