{"title":"Energy efficient cooling of notebook computers","authors":"K. Yazawa, A. Bar-Cohen","doi":"10.1109/ITHERM.2002.1012534","DOIUrl":null,"url":null,"abstract":"The majority of today's leading-edge notebook computers relies on heat pipes for internal spreading and use forced convection, with micro-fans, to reject heat to the ambient. Such techniques have worked efficiently in the relatively flat form factor of these computers, but may not be capable of providing high heat flux cooling in ever shrinking volumes. Moreover, the power limitations of portable computers, as well as growing concern for the environment, make it desirable that the requisite thermal management be accomplished with a minimum expenditure of energy. It is, thus, essential that the developers of such notebook computers follow a rigorous design methodology and achieve an optimal design for energy and space savings. This paper illustrates a \"top down\" thermal design methodology aimed at achieving energy efficient thermal management in a compact notebook computer, while satisfying the requirements for highly integrated design. The paper begins with a review of the passive cooling limits, and uses analytic models to determine the thermal performance that can be attained in a standard notebook form factor. Numerical modeling, along with additional analysis, is used to design the optimum compact active cooling system for both for space and energy efficiency.","PeriodicalId":299933,"journal":{"name":"ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258)","volume":"280 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"13","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ITHERM.2002.1012534","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 13

Abstract

The majority of today's leading-edge notebook computers relies on heat pipes for internal spreading and use forced convection, with micro-fans, to reject heat to the ambient. Such techniques have worked efficiently in the relatively flat form factor of these computers, but may not be capable of providing high heat flux cooling in ever shrinking volumes. Moreover, the power limitations of portable computers, as well as growing concern for the environment, make it desirable that the requisite thermal management be accomplished with a minimum expenditure of energy. It is, thus, essential that the developers of such notebook computers follow a rigorous design methodology and achieve an optimal design for energy and space savings. This paper illustrates a "top down" thermal design methodology aimed at achieving energy efficient thermal management in a compact notebook computer, while satisfying the requirements for highly integrated design. The paper begins with a review of the passive cooling limits, and uses analytic models to determine the thermal performance that can be attained in a standard notebook form factor. Numerical modeling, along with additional analysis, is used to design the optimum compact active cooling system for both for space and energy efficiency.
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笔记本电脑的节能冷却
当今大多数尖端笔记本电脑依靠热管进行内部扩散,并使用带有微型风扇的强制对流将热量排出到环境中。这些技术在这些计算机的相对扁平的外形因素中有效地工作,但可能无法在不断缩小的体积中提供高热流密度冷却。此外,便携式计算机的功率限制,以及对环境的日益关注,使得人们希望以最小的能量消耗来完成必要的热管理。因此,这种笔记本电脑的开发人员必须遵循严格的设计方法,实现节能和节省空间的最佳设计。本文阐述了一种“自上而下”的热设计方法,旨在实现紧凑型笔记本电脑的节能热管理,同时满足高度集成设计的要求。本文首先回顾了被动冷却限制,并使用分析模型来确定在标准笔记本外形因素中可以达到的热性能。数值模拟,连同额外的分析,是用来设计最佳紧凑的主动冷却系统,既为空间和能源效率。
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