Reliability evaluation of multilevel thin film structures

1994 Proceedings. 44th Electronic Components and Technology Conference Pub Date : 1994-05-01 DOI:10.1109/ECTC.1994.367549

H. Longworth, E. Perfecto, P. Mclaughlin

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引用次数: 4

Abstract

IBM Microelectronics has evaluated the reliability of structures built by various processes which we developed for multilevel thin film (MLTF) applications. Two distinct processes were used for the building of conformal copper-polyimide structures on alumina ceramic: Laser ablation of the polyimide for via patterning and wiring defined by subtractive etching of Cr/Cu/Cr, and photosensitive polyimide for via patterning and wiring defined by electroplating through a resist. Reliability evaluation was performed on test-vehicles with both MLTF processes by a combination of IBM standard and MIL-STD-883 stress procedures. These stresses were designed to monitor any potential reliability problems due to metal migration, corrosion (or contamination), metal fatigue, and poor step coverage. Electrical measurements were done before, during, and after stress to check for opens and inter and intralevel shorts. At completion of stressing, no failures were observed in either type of test vehicles. This indicates that both processes meet or exceed IBM current product reliability standards.<>

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多层薄膜结构的可靠性评估

IBM微电子已经评估了我们为多层薄膜(MLTF)应用开发的各种工艺构建的结构的可靠性。在氧化铝陶瓷上构建共形铜-聚酰亚胺结构采用两种不同的工艺:激光烧蚀聚酰亚胺，通过Cr/Cu/Cr的减法蚀刻形成图案和布线;光敏聚酰亚胺，通过电阻电镀形成图案和布线。通过结合IBM标准和MIL-STD-883应力程序，对两种MLTF工艺的测试车辆进行可靠性评估。这些应力被设计用来监测由于金属迁移、腐蚀(或污染)、金属疲劳和台阶覆盖不足而导致的任何潜在可靠性问题。在应力之前、期间和之后都进行了电气测量，以检查开路、节段间和节段内的短路。在应力完成时，两种类型的试验车辆均未观察到失效。这表明这两个过程都达到或超过了IBM当前的产品可靠性标准。

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1994 Proceedings. 44th Electronic Components and Technology Conference

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