Dynamic voltage assignment for thermal-constrained task scheduler on 3D multi-core processors

Chien-Hui Liao, Yu-Ze Lin, Charles H.-P. Wen
{"title":"Dynamic voltage assignment for thermal-constrained task scheduler on 3D multi-core processors","authors":"Chien-Hui Liao, Yu-Ze Lin, Charles H.-P. Wen","doi":"10.1109/VLSI-DAT.2015.7114495","DOIUrl":null,"url":null,"abstract":"Thermal-constrained task scheduler for throughput optimization on 3D multi-core processors (3D-MCPs) has been studied extensively. Most task scheduler focused on thermal-aware task allocation to reduce hotspots, thereby maximizing throughput under thermal constraints. Rather than focusing on the thermal-aware task allocation as previous work does, this work targets on the voltage assignment. In this paper, dynamic voltage assignment is proposed to pre-emptively assign different voltage levels to cores frequently for reducing temperature increase in 3D-MCPs. Experimental results show that two previous task schedulers integrated with the proposed dynamic voltage assignment can lower hotspot occurrences by 62.31% and 59.09%, and improve throughput by 18.28% and 18.35%, respectively. As a result, task schedulers integrated with the proposed dynamic voltage assignment can be more effective to reduce occurrences of hotspots and optimize throughput for 3D-MCPs under thermal constraints.","PeriodicalId":369130,"journal":{"name":"VLSI Design, Automation and Test(VLSI-DAT)","volume":"28 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-04-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"VLSI Design, Automation and Test(VLSI-DAT)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/VLSI-DAT.2015.7114495","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2

Abstract

Thermal-constrained task scheduler for throughput optimization on 3D multi-core processors (3D-MCPs) has been studied extensively. Most task scheduler focused on thermal-aware task allocation to reduce hotspots, thereby maximizing throughput under thermal constraints. Rather than focusing on the thermal-aware task allocation as previous work does, this work targets on the voltage assignment. In this paper, dynamic voltage assignment is proposed to pre-emptively assign different voltage levels to cores frequently for reducing temperature increase in 3D-MCPs. Experimental results show that two previous task schedulers integrated with the proposed dynamic voltage assignment can lower hotspot occurrences by 62.31% and 59.09%, and improve throughput by 18.28% and 18.35%, respectively. As a result, task schedulers integrated with the proposed dynamic voltage assignment can be more effective to reduce occurrences of hotspots and optimize throughput for 3D-MCPs under thermal constraints.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
三维多核处理器上热约束任务调度程序的动态电压分配
三维多核处理器(3D- mcps)吞吐量优化的热约束任务调度程序已经得到了广泛的研究。大多数任务调度器关注热感知任务分配,以减少热点,从而在热约束下最大化吞吐量。与以往的工作不同,这项工作的重点是热感知任务分配,而不是电压分配。本文提出了动态电压分配方法,为减少3d - mcp的温度升高,可以先发制人地频繁地为核心分配不同的电压水平。实验结果表明,集成了动态电压分配方法的前两种任务调度程序,热点发生率分别降低了62.31%和59.09%,吞吐量分别提高了18.28%和18.35%。因此,与所提出的动态电压分配集成的任务调度程序可以更有效地减少热点的发生,并优化热约束下的3d - mcp的吞吐量。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
A 127 fJ/conv. continuous-time delta-sigma modulator with a DWA-embedded two-step time-domain quantizer Biomedical devices and instruments for point-of-care diagnosis Cost challenges on the way to the Internet of Things An in-pixel equalizer with kTC noise cancellation and FPN reduction for time-of-flight CMOS image sensor A dual-edge sampling CES delay-locked loop based clock and data recovery circuits
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1