Self-Heating Effect in Sub-5nm Node Junctionless Multi-Nanosheet FET

Nitish Kumar, Kanyakumari Ashok Bhinge, Sushil Kumar, Samaresh Das, Ankur Gupta, Pushpapraj Singh
{"title":"Self-Heating Effect in Sub-5nm Node Junctionless Multi-Nanosheet FET","authors":"Nitish Kumar, Kanyakumari Ashok Bhinge, Sushil Kumar, Samaresh Das, Ankur Gupta, Pushpapraj Singh","doi":"10.1109/ICEE56203.2022.10117830","DOIUrl":null,"url":null,"abstract":"In this paper, the self-heating effect (SHE) is investigated in single nanosheet to stacked multi-nanosheet channels using the 3D electrothermal module of the Sentaurus TCAD simulation tool. The non-uniform lattice temperature (TL) distribution is observed in the junctionless multi-nanosheet FET. The device performance is enhanced by ~5% when the nanosheet is stacked from a single to three nanosheets, but the maximum lattice temperature (TLmax) also increases by ~66.8 K. The ON-current degradation and TLmax do not only define the device's thermal stability. Therefore, the thermal resistance is obtained by the slope of ΔTLmax and DC power curves, which reflects the low thermal resistance in the multi-nanosheet device. Furthermore, the TLmax of junctionless and inversion mode devices is compared at the same operational power. It is found ~ 100 K lower in junctionless devices due to weak lateral electric field intensity at the channel/drain interface.","PeriodicalId":281727,"journal":{"name":"2022 IEEE International Conference on Emerging Electronics (ICEE)","volume":"27 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-12-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 IEEE International Conference on Emerging Electronics (ICEE)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEE56203.2022.10117830","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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Abstract

In this paper, the self-heating effect (SHE) is investigated in single nanosheet to stacked multi-nanosheet channels using the 3D electrothermal module of the Sentaurus TCAD simulation tool. The non-uniform lattice temperature (TL) distribution is observed in the junctionless multi-nanosheet FET. The device performance is enhanced by ~5% when the nanosheet is stacked from a single to three nanosheets, but the maximum lattice temperature (TLmax) also increases by ~66.8 K. The ON-current degradation and TLmax do not only define the device's thermal stability. Therefore, the thermal resistance is obtained by the slope of ΔTLmax and DC power curves, which reflects the low thermal resistance in the multi-nanosheet device. Furthermore, the TLmax of junctionless and inversion mode devices is compared at the same operational power. It is found ~ 100 K lower in junctionless devices due to weak lateral electric field intensity at the channel/drain interface.
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亚5nm节点无结多纳米片场效应管的自热效应
利用Sentaurus TCAD仿真工具的三维电热模块,研究了单纳米片到堆叠多纳米片通道的自热效应(SHE)。在无结多纳米片场效应管中观察到不均匀的晶格温度分布。当纳米片由单层堆叠到三层堆叠时,器件性能提高了约5%,但最大晶格温度(TLmax)也提高了约66.8 K。导通电流衰减和TLmax不仅定义了器件的热稳定性。因此,通过ΔTLmax和直流功率曲线的斜率得到热阻,反映了多纳米片器件的低热阻。此外,在相同的工作功率下,比较了无结和反转模式器件的TLmax。在无结器件中,由于沟道/漏极界面处的侧向电场强度较弱,该器件的电导率降低了约100 K。
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