Self-aligned InAs/Al0.45Ga0.55Sb vertical tunnel FETs

Guangle Zhou, Y. Lu, R. Li, Q. Zhang, W. Hwang, Q. Liu, T. Vasen, H. Zhu, J. Kuo, S. Koswatta, T. Kosel, M. Wistey, P. Fay, A. Seabaugh, H. Xing
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引用次数: 16

Abstract

Tunnel field-effect transistors (TFETs) are under intense investigation for low-power applications because of their potential for extremely low subthreshold swing (SS) and low off-state leakage [1]. III–V semiconductors with small effective mass and near broken band alignment are considered to be ideal for TFETs in that they promise high on-current and ION/IOFF ratios [2–3]. In this paper, we report the first demonstration of an InAs/Al0.45Ga0.55Sb heterojunction TFETs fabricated using an optical-lithography-only, self-aligned process and also investigate the effects limiting the InAs/Al0.45Ga0.55Sb TFET performance.
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自对准InAs/Al0.45Ga0.55Sb垂直隧道场效应管
隧道场效应晶体管(tfet)由于具有极低的亚阈值摆幅(SS)和低的关闭状态泄漏的潜力,在低功耗应用中受到了广泛的研究[1]。具有小有效质量和近断带对准的III-V半导体被认为是tfet的理想选择,因为它们承诺高导通电流和离子/IOFF比[2-3]。在本文中,我们报道了首次使用光光刻,自校准工艺制备的InAs/Al0.45Ga0.55Sb异质结TFET,并研究了限制InAs/Al0.45Ga0.55Sb TFET性能的影响。
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