{"title":"Thermal characterization of a tape carrier package","authors":"D. E. Pope, H. Do","doi":"10.1109/ECTC.1994.367542","DOIUrl":null,"url":null,"abstract":"The unenhanced thermal performance of Tape carrier Package (TCP) packages on 8 layer boards with internal planes is 19 C/W. Simple PCB enhancements such as the addition of thermal vias, alone or with the use of low profile heatsinks, brings the thermal performance in line with requirements for mobile computing platforms which do not have forced convection cooling options available. With forced convection cooling, devices with a power dissipation requirement of up to 4.7 C/W can be packaged in TCP format.<<ETX>>","PeriodicalId":344532,"journal":{"name":"1994 Proceedings. 44th Electronic Components and Technology Conference","volume":"43 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1994-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"1994 Proceedings. 44th Electronic Components and Technology Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.1994.367542","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 7
Abstract
The unenhanced thermal performance of Tape carrier Package (TCP) packages on 8 layer boards with internal planes is 19 C/W. Simple PCB enhancements such as the addition of thermal vias, alone or with the use of low profile heatsinks, brings the thermal performance in line with requirements for mobile computing platforms which do not have forced convection cooling options available. With forced convection cooling, devices with a power dissipation requirement of up to 4.7 C/W can be packaged in TCP format.<>
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