A methodology to characterize device-level endurance in 1T1C (1-transistor and 1-capacitor) FRAM

W. Ahn, D. Jung, Y.K. Hong, H.H. Kim, Y. Kang, S.K. Kang, H.S. Kim, J. Kim, W. Jung, J. Jung, H. Ko, D. Choi, S.Y. Kim, E.S. Lee, J.Y. Kang, C. Wei, S.Y. Lee, K. A, H. Jung
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引用次数: 1

Abstract

We present a mimicking methodology to describe device-level endurance in a 1T1C, 64 Mb FRAM (ferroelectric random access memory). Device-level endurance of FRAM must clarify all the issues raised from destructive read-out READ/WRITE. To explore endurance properties in a real-time operational situation, we have established a measurement set-up that covers asymmetric pulse chains corresponding to Data 1 (D1) and Data 0 (D0) READ/RESTORE over a frequency range from 1.0 to 7.7 MHz. The cycle-to-failure of 5.9 × 1024 cycles in an operational condition of 7.7 MHz and 85 °C, has been obtained from extrapolation to VDD = 2.0 V in a voltage acceleration. We compare testing results with those of D1¿D0 populations of bit-line potential.
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表征1T1C(1晶体管和1电容器)FRAM器件级耐用性的方法
我们提出了一种模拟方法来描述1T1C, 64 Mb FRAM(铁电随机存取存储器)的设备级耐用性。FRAM的设备级耐用性必须澄清由破坏性读出READ/WRITE引起的所有问题。为了探索实时操作情况下的持久性能,我们建立了一个测量装置,涵盖了在1.0至7.7 MHz的频率范围内,对应于数据1 (D1)和数据0 (D0) READ/RESTORE的非对称脉冲链。在电压加速条件下,通过外推VDD = 2.0 V,得到了7.7 MHz和85℃工作条件下5.9 × 1024个周期的失效周期。我们将测试结果与位线电位D1 ~ D0种群的测试结果进行了比较。
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