mm-wave microstrip and novel slot antennas on low cost large area panel MCM-D substrates-a feasibility and performance study

J. Grzyb, D. Cottet, G. Troster
{"title":"mm-wave microstrip and novel slot antennas on low cost large area panel MCM-D substrates-a feasibility and performance study","authors":"J. Grzyb, D. Cottet, G. Troster","doi":"10.1109/ECTC.2001.927745","DOIUrl":null,"url":null,"abstract":"Recently, there was significant growth in wireless telecommunication applications such as Cellular and Mobile phones, Personal Communication System, Wireless Local Area Network, Pagers, Global Positioning Satellite communication, etc. In future, telecommunication applications will shift more and more to the use of higher frequencies. Multichip Modules (MCMs) and MCM technologies are very close to micro- and millimeter-wave systems like transmitter/receiver (T/R) for radars and communication modules for wireless infrastructure links. There are various stringent requirements for MCMs in this frequency range but one of the most critical requirements is the ability of high RF performance together with high yield and low cost high volume production. Integration of RF circuits and elements with digital and analog circuits on the same substrate is essential to reduce the overall cost and physical dimensions of the whole system. The integrated antenna T/R is a very interesting alternative for applications where compact design, low cost, and high volume are important factors. Integration of the antenna in such a module is very difficult because the technological requirements driven by its performance characteristics (radiation efficiency, bandwidth) are opposite to these of non-radiating elements, where the radiation effect is not desirable. This issue is especially important for low-profile build-up MCM-D technologies where the problem of radiation efficiency of microstrip antennas is extremely difficult to solve. This paper will discuss the EM based modelling and practical design of microstrip and novel slot antennas in the mm-wave frequency range (30-85 GHz) on low cost MCM-D substrates. The critical parameters of millimeter design such as losses, bandwidth, and radiation pattern will be discussed. To perform this feasibility study a finite element method (FEM) is used as a simulation tool and HP8510XF Vector Network Analyzer (VNA) as a measurement equipment.","PeriodicalId":340217,"journal":{"name":"2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220)","volume":"83 3 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2001-05-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.2001.927745","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

Abstract

Recently, there was significant growth in wireless telecommunication applications such as Cellular and Mobile phones, Personal Communication System, Wireless Local Area Network, Pagers, Global Positioning Satellite communication, etc. In future, telecommunication applications will shift more and more to the use of higher frequencies. Multichip Modules (MCMs) and MCM technologies are very close to micro- and millimeter-wave systems like transmitter/receiver (T/R) for radars and communication modules for wireless infrastructure links. There are various stringent requirements for MCMs in this frequency range but one of the most critical requirements is the ability of high RF performance together with high yield and low cost high volume production. Integration of RF circuits and elements with digital and analog circuits on the same substrate is essential to reduce the overall cost and physical dimensions of the whole system. The integrated antenna T/R is a very interesting alternative for applications where compact design, low cost, and high volume are important factors. Integration of the antenna in such a module is very difficult because the technological requirements driven by its performance characteristics (radiation efficiency, bandwidth) are opposite to these of non-radiating elements, where the radiation effect is not desirable. This issue is especially important for low-profile build-up MCM-D technologies where the problem of radiation efficiency of microstrip antennas is extremely difficult to solve. This paper will discuss the EM based modelling and practical design of microstrip and novel slot antennas in the mm-wave frequency range (30-85 GHz) on low cost MCM-D substrates. The critical parameters of millimeter design such as losses, bandwidth, and radiation pattern will be discussed. To perform this feasibility study a finite element method (FEM) is used as a simulation tool and HP8510XF Vector Network Analyzer (VNA) as a measurement equipment.
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低成本大面积面板MCM-D基板上的毫米波微带和新型缝隙天线的可行性和性能研究
近年来,蜂窝电话和移动电话、个人通信系统、无线局域网、寻呼机、全球定位卫星通信等无线通信应用有了显著的增长。未来,电信应用将越来越多地转向使用更高的频率。多芯片模块(MCM)和MCM技术非常接近微毫米波系统,如雷达的发射机/接收机(T/R)和无线基础设施链路的通信模块。在这个频率范围内,对mcm有各种严格的要求,但最关键的要求之一是具有高射频性能以及高产量和低成本大批量生产的能力。将射频电路和元件与数字和模拟电路集成在同一基板上,对于降低整个系统的总体成本和物理尺寸至关重要。集成天线T/R是一个非常有趣的选择,在应用中,紧凑的设计,低成本和高容量是重要的因素。在这样的模块中集成天线是非常困难的,因为其性能特征(辐射效率、带宽)驱动的技术要求与非辐射元件的技术要求相反,而非辐射元件的辐射效果是不理想的。在微带天线的辐射效率问题极难解决的情况下,这一问题对于低姿态构建MCM-D技术尤为重要。本文将讨论在低成本MCM-D基板上基于EM的微带和新型槽天线的建模和实际设计,其频率范围为毫米波(30-85 GHz)。毫米设计的关键参数,如损耗,带宽和辐射方向图将被讨论。为了进行可行性研究,采用有限元法(FEM)作为仿真工具,HP8510XF矢量网络分析仪(VNA)作为测量设备。
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