{"title":"Air-gap capacitance-Voltage analysis of p-InP surfaces","authors":"Toshiyuki Yoshida, T. Hashizume","doi":"10.1109/ICIPRM.2010.5516369","DOIUrl":null,"url":null,"abstract":"A novel air-gap capacitance-Voltage (C-V) method is introduced. This method is powerful tool for characterizing electrical properties of \"free\" or ultrathin-insulator-covered surfaces for III-V semiconductors. Air-gap C-V characteristics of p-InP surfaces with and without natural oxide are reported for the first time. Unexpectedly, the surface with natural oxide gives relatively low-density surface states. Surfaces covered with ultrathin Al2O3 film were also measured, indicating the importance for further investigation and optimization of surface process.","PeriodicalId":197102,"journal":{"name":"2010 22nd International Conference on Indium Phosphide and Related Materials (IPRM)","volume":"34 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2010-07-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2010 22nd International Conference on Indium Phosphide and Related Materials (IPRM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICIPRM.2010.5516369","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
A novel air-gap capacitance-Voltage (C-V) method is introduced. This method is powerful tool for characterizing electrical properties of "free" or ultrathin-insulator-covered surfaces for III-V semiconductors. Air-gap C-V characteristics of p-InP surfaces with and without natural oxide are reported for the first time. Unexpectedly, the surface with natural oxide gives relatively low-density surface states. Surfaces covered with ultrathin Al2O3 film were also measured, indicating the importance for further investigation and optimization of surface process.