Critical Charge Dependency of Single Event Upset (SEU) on the Supply Voltage in Nanometric CMOS SRAMs

M. Soleimaninia, G. Raisali, A. Moslehi
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Abstract

Rapid scaling of integrated devices and circuits has been led to the serious concerns in nanometric technologies. Continuous downscaling of CMOS technology has been resulted into the decrease in the critical charge of memory devices like SRAM in nanometric technologies and made them more susceptible to Single Event Upsets (SEUs). Critical charge as the criterion of SEU vulnerability, is the minimum charge required to change a memory cell which is mainly attributed to the scaling of the supply voltage. In this paper, the dependence of critical charge on the supply voltage in a 65-nm CMOS SRAM has been studied. To this purpose, a memory cell was designed using Silvaco TCAD tool and incident particles with different values of Linear Energy Transfer (LET) struck on it. Then, the critical charge has been calculated at three supply voltages. The results exhibit significant changes of critical charge due to supply voltage variations. So that, lowering in the supply voltage has been resulted to the decrease in critical charge.
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单事件干扰(SEU)的临界电荷对纳米CMOS sram电源电压的依赖性
集成器件和电路的快速规模化已经引起了纳米技术的严重关注。CMOS技术的不断缩小导致纳米技术中SRAM等存储器件的临界电荷降低,使其更容易受到单事件扰动(seu)的影响。临界电荷是衡量单单元脆弱性的标准,它是改变存储单元所需的最小电荷,主要归因于电源电压的缩放。本文研究了65nm CMOS SRAM中临界电荷与电源电压的关系。为此,利用Silvaco TCAD工具设计了一个存储单元,并以不同的线性能量传递(LET)值入射粒子撞击存储单元。然后,计算了三种电源电压下的临界电荷。结果表明,由于电源电压的变化,临界电荷发生了显著的变化。因此,电源电压的降低导致了临界电荷的降低。
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