High Fmax GaN-HEMT with High Breakdown Voltage for Millimeter-Wave Applications

T. Kikkawa, K. Makiyama, K. Imanishi, T. Ohki, M. Kanamura, N. Okamoto, N. Hara, K. Joshin
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引用次数: 7

Abstract

The state-of-the-art GaN high electron mobility transistors (GaN-HEMTs) technology for millimeter-wave amplifiers is described in this paper. A high maximum frequency of an oscillation (fmax) device with high breakdown voltage (BVgd) was focused on to improve the gain, efficiency, and reliability of the millimeter-wave amplifier. In this study, we demonstrated a high fmax of 180 GHz with a BVgd of 190 V using a novel Y-shaped Schottky gate and n-type doped GaN cap structure. The effects of the AlGaN layer, device dimensions, and sheet resistance were investigated to obtain a highly reliable W- band power amplifier. Index Terms — Semiconductor devices, Millimeter-wave FETs, power amplifiers.
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用于毫米波应用的高击穿电压GaN-HEMT
介绍了用于毫米波放大器的GaN高电子迁移率晶体管(GaN- hemts)技术。为了提高毫米波放大器的增益、效率和可靠性,研究了一种高击穿电压(BVgd)振荡器件的最高频率。在这项研究中,我们使用了一种新型的y形肖特基栅极和n型掺杂GaN帽结构,展示了180 GHz的高fmax和190 V的BVgd。为了获得高可靠性的W波段功率放大器,研究了AlGaN层、器件尺寸和片电阻的影响。索引术语。半导体器件,毫米波场效应管,功率放大器
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