Design and verification of partitional thermal control for space CMOS electric cabinet

Abstract

The structure of a space electric cabinet based on a commercial CMOS chip is presented. Analysis is conducted according to the temperature specifications and the environmental constraints, which indicates the partitional thermal control method has higher energy efficiency than conventional TEC cooling. A flexible graphite thermal cable is used to build an independent cooling path for the focal plane component. The camera hood is utilized to cool down the peripheral circuit. Copper sinks are designed for high power electronic components. The thermal control design is verified by finite element simulation analysis and thermal balance test. The experimental results show that the partitional thermal control measures are effective and feasible, which can ensure the -30°C operating temperature of CMOS chip and the derating requirements of components with high power consumption.