Flip chip interconnects based on carbon nanofibers-solder composites

E. Passalacqua, C. Laprais, M. Bylund, Q. Li, V. Marknäs, R. Andersson, A. Saleem, V. Desmaris
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Abstract

In this paper, we propose the introduction of vertically aligned carbon nanofibers (CNF) directly grown on the bonding pad by chemical vapor deposition at CMOS compatible temperatures as a solution to reinforce and confine the solder joint between two chips bonded by solder. This concept potentially enables the reduction of pitches and size of the solder interconnects. The solder joints are realized by thermal compression bonding technique and the assemblies are characterized by means of electrical measurements of daisy chains and kelvin structures formed by the connection of the two chips. Flip chip interconnects based on two solder composite solutions (CNFs/SnAg and CNFs/SAC305) are analyzed in terms of electrical resistance, and different growth conditions for the CNFs and a post-growth treatment have been tested. The addition of the carbon nanofibers to the solder led to an additional resistance lower than 10% of the total resistance, while possibly improving the reliability of the joint.
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基于碳纳米纤维-焊料复合材料的倒装芯片互连
在本文中,我们提出在CMOS兼容的温度下,通过化学气相沉积在键合板上直接生长垂直排列的碳纳米纤维(CNF),作为一种增强和限制焊料连接的两个芯片之间的焊点的解决方案。这一概念有可能减小焊料互连的间距和尺寸。焊点通过热压缩键合技术实现,组件通过雏菊链和两个芯片连接形成的开尔文结构的电气测量来表征。分析了基于两种焊料复合方案(CNFs/SnAg和CNFs/SAC305)的倒装芯片互连的电阻,并测试了CNFs的不同生长条件和生长后处理。在焊料中添加碳纳米纤维导致的附加电阻低于总电阻的10%,同时可能提高接头的可靠性。
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