Fabrication, Assembly, and Characterization of Stacked Multichip Modules Using Hot Pressed, Co-Fired Aluminum Nitride

Abstract

A three-dimensional interconnect structure utilizing MCM-C technology is currently being developed by Honeywell Solid State Electronics Center (SSEQ and Coors Electronic Package Company. This concept involves the stacking of double sided co-fired aluminum nitride (AIN) MCMs. The double sided MCMs are stacked vertically using solder attached co-fired AIN spacer bars that have been manufactured with metallized through vias and have been designed to incorporate all electrical interconnection within the ceramic. The spacer bar acts as a thermal and electrical interconnect between substrates. Prototypes are currently being produced and evaluated for thermal, electrical, and mechanical integrity. Two technology characterization vehicles (TCVs) have been designed and constructed; the first TCV contains 6 metal layers and sites for wirebond, tape automated bonding (TAB), and flip chip mounting. A second characterization vehicle contains 15 metal planes and additional electrical characterization features. This paper will discuss the fabrication and assembly of the two TCVs. This Three-Dimensional Interconnect Structures Program is being funded by Naval Command, Control and Ocean Surveillance Center (NCCOSC).