{"title":"Towards Hybrid Optical Components via Non-Planar Direct Bonding","authors":"P. Birckigt, C. Rothhardt, S. Risse, U. Zeitner","doi":"10.1109/LTB-3D53950.2021.9598402","DOIUrl":null,"url":null,"abstract":"Here, we tackle the paradigm that direct bonding of planar wafers is not suitable on non-planar substrates. In doing so, we also present a new method for measuring the interface surface energy. This yields first guidelines for manufacturing novel optical components which combine different optical properties.","PeriodicalId":198318,"journal":{"name":"2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2021-10-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/LTB-3D53950.2021.9598402","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
Here, we tackle the paradigm that direct bonding of planar wafers is not suitable on non-planar substrates. In doing so, we also present a new method for measuring the interface surface energy. This yields first guidelines for manufacturing novel optical components which combine different optical properties.
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