{"title":"A /spl mu/Watt postage stamp PC","authors":"David G. England","doi":"10.1109/ASIC.1998.722819","DOIUrl":null,"url":null,"abstract":"This paper gives details of a Intel386/sup TM/ microprocessor based system in a single package. The functionality of this single device is somewhat equivalent to a 1990 PC. However, the design includes many features that significantly reduce power consumption. The design incorporates 'Few Chip Package (FCP)' technology to marry 0.35 micron logic die and 0.35 micron flash memory technologies in a single 23 mm package. The main feature of the part is its reduced average power consumption of less than 1 mW in target applications.","PeriodicalId":104431,"journal":{"name":"Proceedings Eleventh Annual IEEE International ASIC Conference (Cat. No.98TH8372)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1998-09-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings Eleventh Annual IEEE International ASIC Conference (Cat. No.98TH8372)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ASIC.1998.722819","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
This paper gives details of a Intel386/sup TM/ microprocessor based system in a single package. The functionality of this single device is somewhat equivalent to a 1990 PC. However, the design includes many features that significantly reduce power consumption. The design incorporates 'Few Chip Package (FCP)' technology to marry 0.35 micron logic die and 0.35 micron flash memory technologies in a single 23 mm package. The main feature of the part is its reduced average power consumption of less than 1 mW in target applications.
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