Evaluation of the PTSI Crosstalk Noise Analysis Tool and Development of an Automated Spice Correlation Suite to Enable Accuracy Validation

C. R. Venugopal, Prasanth Soraiyur, J. Rao
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引用次数: 3

Abstract

As process geometries are shrinking, width of the metal layer is continuously decreasing, height of the layer and wire lengths are increasing, thereby increasing the effect of coupling capacitances. Coupling induced crosstalk may induce unwanted noise on coupled signal nets resulting in functional failure and performance degradation and becomes a significant limitation in achieving first pass silicon success. At the same time the complexity of noise analysis has significantly increased due to factors such as driver weakening, IR drop, power network switching, voltage scaling and variations in manufacturing processes. Therefore validating the capabilities and verifying the analysis of a crosstalk analysis tool for current and future process nodes is very critical for efficient and accurate signoff analysis. The modeling of the cell itself needs to be accurate and comprehensive. The objective of the paper is to share the methodology and challenges involved in crosstalk noise analysis and how the composite current source (CCS) based crosstalk noise analysis capability of primetime SI would help us achieve many of our goals.
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PTSI串扰噪声分析工具的评估和自动化香料相关套件的开发,以实现准确性验证
随着工艺几何尺寸的缩小,金属层的宽度不断减小,层的高度和导线的长度不断增加,从而增加了耦合电容的影响。耦合诱导串扰可能会在耦合信号网络上产生不必要的噪声,导致功能失效和性能下降,并成为实现首次通过硅成功的重要限制。同时,由于驱动器减弱、红外下降、电网切换、电压缩放和制造工艺变化等因素,噪声分析的复杂性大大增加。因此,验证当前和未来过程节点的串扰分析工具的功能和验证分析对于有效和准确的签名分析非常关键。细胞本身的建模需要准确和全面。本文的目的是分享串声噪声分析所涉及的方法和挑战,以及基于复合电流源(CCS)的黄金时间SI串声噪声分析能力将如何帮助我们实现许多目标。
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