{"title":"Correction to: Transient Liquid Phase Bonding","authors":"J. R. Holaday, C. Handwerker","doi":"10.1007/978-3-319-99256-3_11","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":184387,"journal":{"name":"Die-Attach Materials for High Temperature Applications in Microelectronics Packaging","volume":"66 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Die-Attach Materials for High Temperature Applications in Microelectronics Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1007/978-3-319-99256-3_11","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
