Pub Date : 1900-01-01DOI: 10.1007/978-3-319-99256-3_11
J. R. Holaday, C. Handwerker
{"title":"Correction to: Transient Liquid Phase Bonding","authors":"J. R. Holaday, C. Handwerker","doi":"10.1007/978-3-319-99256-3_11","DOIUrl":"https://doi.org/10.1007/978-3-319-99256-3_11","url":null,"abstract":"","PeriodicalId":184387,"journal":{"name":"Die-Attach Materials for High Temperature Applications in Microelectronics Packaging","volume":"66 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126519442","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1900-01-01DOI: 10.1007/978-3-319-99256-3_4
P. Paret, D. DeVoto, S. Narumanchi
{"title":"Thermomechanical Modeling of High-Temperature Bonded Interface Materials","authors":"P. Paret, D. DeVoto, S. Narumanchi","doi":"10.1007/978-3-319-99256-3_4","DOIUrl":"https://doi.org/10.1007/978-3-319-99256-3_4","url":null,"abstract":"","PeriodicalId":184387,"journal":{"name":"Die-Attach Materials for High Temperature Applications in Microelectronics Packaging","volume":"71 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127387474","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1900-01-01DOI: 10.1007/978-3-319-99256-3
K. Siow, S. Ang, F. Masana
{"title":"Die-Attach Materials for High Temperature Applications in Microelectronics Packaging: Materials, Processes, Equipment, and Reliability","authors":"K. Siow, S. Ang, F. Masana","doi":"10.1007/978-3-319-99256-3","DOIUrl":"https://doi.org/10.1007/978-3-319-99256-3","url":null,"abstract":"","PeriodicalId":184387,"journal":{"name":"Die-Attach Materials for High Temperature Applications in Microelectronics Packaging","volume":"110 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133511482","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1900-01-01DOI: 10.1007/978-3-319-99256-3_1
S. Chen, H. Zhang
{"title":"Silver Sintering and Soldering: Bonding Process and Comparison","authors":"S. Chen, H. Zhang","doi":"10.1007/978-3-319-99256-3_1","DOIUrl":"https://doi.org/10.1007/978-3-319-99256-3_1","url":null,"abstract":"","PeriodicalId":184387,"journal":{"name":"Die-Attach Materials for High Temperature Applications in Microelectronics Packaging","volume":"17 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115341772","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1900-01-01DOI: 10.1007/978-3-319-99256-3_5
Y. Mei, Z. Wang, K. Siow
{"title":"Reliability and Failure Mechanisms of Sintered Silver as Die Attach Joint","authors":"Y. Mei, Z. Wang, K. Siow","doi":"10.1007/978-3-319-99256-3_5","DOIUrl":"https://doi.org/10.1007/978-3-319-99256-3_5","url":null,"abstract":"","PeriodicalId":184387,"journal":{"name":"Die-Attach Materials for High Temperature Applications in Microelectronics Packaging","volume":"3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116949051","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1900-01-01DOI: 10.1007/978-3-319-99256-3_10
Z. Shen, O. Fanini
{"title":"Die-Attach Materials for Extreme Conditions and Harsh Environments","authors":"Z. Shen, O. Fanini","doi":"10.1007/978-3-319-99256-3_10","DOIUrl":"https://doi.org/10.1007/978-3-319-99256-3_10","url":null,"abstract":"","PeriodicalId":184387,"journal":{"name":"Die-Attach Materials for High Temperature Applications in Microelectronics Packaging","volume":"139 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123229403","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1900-01-01DOI: 10.1007/978-3-319-99256-3_3
K. Siow, V. R. Manikam, S. T. Chua
{"title":"Process Control of Sintered Ag Joint in Production for Die Attach Applications","authors":"K. Siow, V. R. Manikam, S. T. Chua","doi":"10.1007/978-3-319-99256-3_3","DOIUrl":"https://doi.org/10.1007/978-3-319-99256-3_3","url":null,"abstract":"","PeriodicalId":184387,"journal":{"name":"Die-Attach Materials for High Temperature Applications in Microelectronics Packaging","volume":"68 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127760232","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1900-01-01DOI: 10.1007/978-3-319-99256-3_9
J. R. Holaday, C. Handwerker
{"title":"Transient Liquid Phase Bonding","authors":"J. R. Holaday, C. Handwerker","doi":"10.1007/978-3-319-99256-3_9","DOIUrl":"https://doi.org/10.1007/978-3-319-99256-3_9","url":null,"abstract":"","PeriodicalId":184387,"journal":{"name":"Die-Attach Materials for High Temperature Applications in Microelectronics Packaging","volume":"59 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131426886","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1900-01-01DOI: 10.1007/978-3-319-99256-3_6
S. Mannan, A. Paknejad, A. Mansourian, Khalid Khtatba
{"title":"Morphological Changes in Sintered Silver Due to Atomic Migration","authors":"S. Mannan, A. Paknejad, A. Mansourian, Khalid Khtatba","doi":"10.1007/978-3-319-99256-3_6","DOIUrl":"https://doi.org/10.1007/978-3-319-99256-3_6","url":null,"abstract":"","PeriodicalId":184387,"journal":{"name":"Die-Attach Materials for High Temperature Applications in Microelectronics Packaging","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129564608","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1900-01-01DOI: 10.1007/978-3-319-99256-3_8
Y. Yamada
{"title":"Sintered Copper (Cu): Chemistry, Process, and Reliability","authors":"Y. Yamada","doi":"10.1007/978-3-319-99256-3_8","DOIUrl":"https://doi.org/10.1007/978-3-319-99256-3_8","url":null,"abstract":"","PeriodicalId":184387,"journal":{"name":"Die-Attach Materials for High Temperature Applications in Microelectronics Packaging","volume":"29 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123041693","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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