X. Sun, G. Posada, B. Majeed, W. Zhang, W. De Raedt, C. Diekmann, C. Eggs, E. Schmidhammer
{"title":"3D stack packaging solution for BAW devices: 3D packaging demonstrator and RF performance","authors":"X. Sun, G. Posada, B. Majeed, W. Zhang, W. De Raedt, C. Diekmann, C. Eggs, E. Schmidhammer","doi":"10.1109/ESSDERC.2011.6044218","DOIUrl":null,"url":null,"abstract":"This paper presents a 3D integration concept as a solution to package FBAR or BAW devices providing at the same time additional RF functionality. The feasibility of this 3D packaging solution has been proven by the successful realization of a 3D packaging demonstration vehicle including FBAR device, solder ring, bumps, through substrate via, low loss interconnects and extra integrated RF functionality. A good RF performance has been obtained. This concept could also be used for the packaging of MEMS, since the requirements are similar.","PeriodicalId":161896,"journal":{"name":"2011 Proceedings of the European Solid-State Device Research Conference (ESSDERC)","volume":"21 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2011-10-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2011 Proceedings of the European Solid-State Device Research Conference (ESSDERC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ESSDERC.2011.6044218","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
This paper presents a 3D integration concept as a solution to package FBAR or BAW devices providing at the same time additional RF functionality. The feasibility of this 3D packaging solution has been proven by the successful realization of a 3D packaging demonstration vehicle including FBAR device, solder ring, bumps, through substrate via, low loss interconnects and extra integrated RF functionality. A good RF performance has been obtained. This concept could also be used for the packaging of MEMS, since the requirements are similar.
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