{"title":"Application of CFD Technology to electronic thermal management","authors":"T. Lee, B. Chambers, M. Mahalingam","doi":"10.1109/ECTC.1994.367557","DOIUrl":null,"url":null,"abstract":"Application of a Computational Fluids Dynamics (CFD) tool to the thermal modeling of free convection cooled handheld/portable products and component level products is assessed. The results of two case studies are reviewed. The first case focuses on a sealed, system level enclosure typical of portable consumer products; while the second case looks at a component level analysis of a sealed multichip module (MCM) package possessing an internal cavity. Temperatures predicted by the simulations are compared to available experimental data as a means of assessing the software's ability to adequately solve the coupled fluid dynamics/heat transfer problem. All simulation results were within 10% of experimental results for these two cases, indicating the software is readily capable of providing good thermal performance predictions.<<ETX>>","PeriodicalId":344532,"journal":{"name":"1994 Proceedings. 44th Electronic Components and Technology Conference","volume":"135 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1994-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"49","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"1994 Proceedings. 44th Electronic Components and Technology Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.1994.367557","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 49
Abstract
Application of a Computational Fluids Dynamics (CFD) tool to the thermal modeling of free convection cooled handheld/portable products and component level products is assessed. The results of two case studies are reviewed. The first case focuses on a sealed, system level enclosure typical of portable consumer products; while the second case looks at a component level analysis of a sealed multichip module (MCM) package possessing an internal cavity. Temperatures predicted by the simulations are compared to available experimental data as a means of assessing the software's ability to adequately solve the coupled fluid dynamics/heat transfer problem. All simulation results were within 10% of experimental results for these two cases, indicating the software is readily capable of providing good thermal performance predictions.<>
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