Thermal resistance analysis of micro channel structure with 1D and Q2D methods

Abstract

The one dimensional (1D) and quasi-two dimensional (Q2D) methods were applied to estimate and analyze the thermal resistance of the previous boiling experiments with silicon and copper micro channel wick structures. The variations of temperature and thermal resistance with different heat loads were shown, and the 1D and Q2D methods were used for calculation and comparison with experimental data. The results show that the Q2D method can predict the thermal resistance with a higher accuracy because the spreading resistance is unignorable and should be considered. The present results can be a useful reference for future thermal and cooling designs.