High-productivity direct-write e-beam lithography: an enabling patterning technology to augment your lithography toolbox

K. Macwilliams, A. Ceballos, Ted Prescop, D. K. Lam
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Abstract

Multibeam Corporation has overcome the productivity limitations of conventional single-electron-beam lithography to enable high-speed, flexible, and high-resolution patterning in a range of new and existing applications. The high-productivity Multicolumn Electron Beam Lithography (MEBL) system combines a modular architecture with unique miniature e-beam columns to achieve productivity that is taking e-beam lithography from lab to fab. MEBL exhibits 10 to 100x productivity in most applications compared to conventional e-beam lithography. Beyond its superior resolution, MEBL also offers several important advantages over conventional photolithography: (1) Depth of Focus – over 100x larger than state-of-the-art optical systems. (2) Full-wafer Writing Field – the ability to write unique, seamless patterns over an entire wafer, not limited by conventional optical reticle size (typically 26 mm x 33 mm). (3) Perhaps most powerfully – direct writing is maskless. E-beam lithography is adaptable and is not constrained by the time, cost, defectivity, and security risks of the optical mask production process. The design and manufacturing capabilities that emerge from combining high-productivity with these unique e-beam lithography capabilities enable many key applications: super-large interposers for microelectronics advanced packaging (that can achieve size, weight, power, and performance close to that of wafer-scale integration); seamless patterning of readout integrated circuits (ROICs) and other larger-area devices; built-in Secure Chip IDs that ensure security and chip-level traceability; and high-mix, low-volume production (to leverage high-volume IC technology for low-volume applications). The adaptable, direct-write nature of e-beam lithography also enables early concept prototyping that accelerates technology development, production ramp-up, and system deployments. These advanced capabilities are shown using Multibeam’s high-productivity, direct-write MEBL system.
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高生产率直写电子束光刻:一种使能的图形技术,以增加您的光刻工具箱
Multibeam公司克服了传统单电子束光刻的生产效率限制,在一系列新的和现有的应用中实现了高速、灵活和高分辨率的图形。高生产率的多柱电子束光刻(MEBL)系统结合了模块化架构和独特的微型电子束柱,以实现从实验室到工厂的电子束光刻的生产率。与传统电子束光刻相比,MEBL在大多数应用中表现出10到100倍的生产率。除了其优越的分辨率,MEBL还提供了几个重要的优势比传统的光刻:(1)聚焦深度-超过100倍的最先进的光学系统。(2)全晶圆书写领域-在整个晶圆上书写独特,无缝图案的能力,不受传统光学光栅尺寸(通常为26 mm x 33 mm)的限制。(3)也许最有力的是——直接写作是没有面具的。电子束光刻技术适应性强,不受光掩模生产过程的时间、成本、缺陷和安全风险的限制。将高生产率与这些独特的电子束光刻能力相结合所产生的设计和制造能力使许多关键应用成为可能:用于微电子先进封装的超大中间体(可以实现尺寸,重量,功率和性能接近晶圆级集成);读出集成电路(roic)和其他更大面积器件的无缝图像化;内置安全芯片id,确保安全性和芯片级可追溯性;以及高混合、小批量生产(利用大批量集成电路技术实现小批量应用)。电子束光刻具有适应性强、直接写入的特点,能够实现早期概念原型,从而加速技术开发、生产提升和系统部署。这些先进的功能通过Multibeam的高生产率、直写MEBL系统得到了展示。
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