Formation of grooves in SiO2 coated silicon using femtosecond ytterbium DPSS laser

A. Melninkaitis, T. Balciunas, V. Sirutkaitis, V. Juzumas, J. Janušonis, G. Šlekys
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Abstract

Femtosecond laser micromachining of grooves in the SiO2 coated crystal silicon is investigated using 300 fs laser pulses at a center wavelength of 1030 nm. A novel chirped pulse amplified femtosecond Yb:KGW laser source (Pharos, Light Conversion, Lithuania) with high pulse repetition rate of 1- 350 kHz and high average power up to 8 W is employed. The ablation depth of grooves as a function of pulse repetition rate, number of passes over the same groove, and the light polarization relative to the cutting direction is investigated. Different scanning algorithms as well as influence of the focal plane height relative to the sample are investigated.
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利用飞秒镱DPSS激光在SiO2涂层硅上形成沟槽
利用中心波长为1030 nm的300 fs激光脉冲,研究了SiO2包覆晶体硅沟槽的飞秒激光微加工。采用了一种新型啁啾脉冲放大飞秒Yb:KGW激光源(Pharos, Light Conversion,立陶宛),脉冲重复率为1 ~ 350khz,平均功率高达8w。研究了脉冲重复频率、经过同一沟槽的次数以及相对于切割方向的光偏振对沟槽烧蚀深度的影响。研究了不同的扫描算法以及焦平面相对于样品高度的影响。
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