Enhanced reliability of HEMT by using a TiN barrier

M. Taniguchi, Y. Amano, T. Nemoto, K. Shinohara
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引用次数: 5

Abstract

The use of Auger electron spectroscopy (AES) to explore the failure mechanism of high electron mobility transistors (HEMTs) subjected to high temperature storage (HTS) and operating life tests is discussed. Degradation at the early stage of HTS is associated with significant amounts of Ga and As outdiffusion through the ohmic areas. A TiN barrier placed between the AuGe/Ni/Au contact and the Ti/Pt/Au overlay metal is effective in eliminating this degradation and increasing the mean time to failure (MTTF) to >10/sup 8/ hours at 125 degrees C channel temperature.<>
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使用TiN势垒增强HEMT的可靠性
讨论了利用俄歇电子能谱(AES)研究高电子迁移率晶体管(hemt)在高温储存(HTS)和工作寿命试验下的失效机理。高温超导初期的降解与大量的镓和砷通过欧姆区向外扩散有关。在AuGe/Ni/Au触点和Ti/Pt/Au覆盖金属之间放置TiN屏障可有效消除这种降解,并在125℃通道温度下将平均失效时间(MTTF)增加到>10/sup / 8/小时。
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