A Corrected method for Calculation of Failure Rate Based on IEC-TR-62380

Abolfazl Babaei, Arman Najafizadeh, Iman Kaffashan, H. Rezaei
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引用次数: 3

Abstract

In this paper an optimized way of failure rate and mean time between failure evaluation can be used in the multilevel inverters is proposed. Actually, There are two main references, MIL-HDBK and IEC handbook, used for failure rate calculation. Considering this, lots of literatures used to use MIL-HDBK for failure rate analysis. However, According to the comparison having been done in this paper, some effective parameters are not considered in the MIL-HDBK standard, and these parameters are included environmental conditions, package type and operation time. Therefore, the calculation results of the failure rate and MTBF based on MIL-HDBK are not accurate. In this paper, an improved method in which the most important parameters effective on the failure rate and MTBF are considered by considering the IEC handbook as the main standard for calculation. Because of this point that the IEC handbook standard considers environmental conditions, package type and operation time for each component, the calculation results based on the standard are more precise than MLL-HDBK one. Apart from that, for calculation of the either conduction loss or switching loss, a precise method is used because most of the published papers used a conventional method for power calculations, and that is why temperature and failure rate calculations in those papers are not accurate enough to be able to calculate junction temperature, failure rate, and MTBF correctly. Eventually, the presented method is evaluated by a five-level NPC simulation in the PLECS software. Finally, theoretical and simulation results of the conduction and switching losses are very close to each other.
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基于IEC-TR-62380的故障率计算修正方法
本文提出了一种可用于多电平逆变器的故障率和平均故障间隔时间评估的优化方法。实际上,故障率的计算主要参考MIL-HDBK和IEC手册。因此,很多文献采用MIL-HDBK进行故障率分析。然而,根据本文的对比,MIL-HDBK标准中没有考虑到一些有效的参数,这些参数包括环境条件、封装类型和操作时间。因此,基于MIL-HDBK的故障率和MTBF的计算结果并不准确。本文以IEC手册为主要计算标准,考虑影响故障率和MTBF的重要参数,提出了一种改进方法。由于IEC手册标准考虑了每个部件的环境条件、封装类型和操作时间,因此基于该标准的计算结果比mml - hdbk计算结果更为精确。除此之外,对于传导损耗或开关损耗的计算,使用了一种精确的方法,因为大多数已发表的论文使用传统的方法进行功率计算,这就是为什么这些论文中的温度和故障率计算不够精确,无法正确计算结温,故障率和MTBF。最后,通过PLECS软件中的五级NPC仿真对所提出的方法进行了评估。最后,导通损耗和开关损耗的理论和仿真结果非常接近。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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