Realistic CNFET based SRAM cell design for better write stability

B. Ebrahimi, A. Afzali-Kusha
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引用次数: 9

Abstract

In this paper, a comparison between CNFET and Si-MOSFET SRAM cells at 32nm technology node are presented. The designs are based on predictive technology model (PTM) for the Si-MOSFET cell and CNFET Stanford model for the CNFET cell. For practical reasons, in the CNFET case, the substrate of the entire chip is considered to be one node. The effect of the voltage of this node on improving the overall characteristics of the CNFET cell is described. HSPICE simulation results show that CNFET has better performance compared to Si-MOSFET. Finally, the characteristics of the SRAM cell in the presence of fabrication imperfections of CNFET are studied. The write stability of CNFET SRAM is low because of the same current drive capability for both p- and n-CNFETs. For solving this problem, we weaken the pull up transistors by different channel length and CNT diameter with respect to n type transistors.
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基于CNFET的SRAM单元设计,具有更好的写入稳定性
本文对CNFET和Si-MOSFET SRAM电池在32nm工艺节点上的性能进行了比较。该设计基于Si-MOSFET电池的预测技术模型(PTM)和CNFET电池的斯坦福模型。由于实际原因,在CNFET的情况下,整个芯片的衬底被认为是一个节点。描述了该节点电压对改善CNFET电池整体特性的影响。HSPICE仿真结果表明,CNFET与Si-MOSFET相比具有更好的性能。最后,研究了在CNFET制造缺陷存在的情况下SRAM电池的特性。由于p-和n-CNFET的电流驱动能力相同,CNFET SRAM的写入稳定性较低。为了解决这个问题,我们通过不同的沟道长度和碳纳米管直径来削弱n型晶体管的拉升晶体管。
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