TestDNA-E: Wafer Defect Signature for Pattern Recognition by Ensemble Learning

L. Chen, Katherine Shu-Min Li, Ken Chau-Cheung Cheng, Sying-Jyan Wang, Andrew Yi-Ann Huang, Leon Chou, Nova Cheng-Yen Tsai, Chen-Shiun Lee
{"title":"TestDNA-E: Wafer Defect Signature for Pattern Recognition by Ensemble Learning","authors":"L. Chen, Katherine Shu-Min Li, Ken Chau-Cheung Cheng, Sying-Jyan Wang, Andrew Yi-Ann Huang, Leon Chou, Nova Cheng-Yen Tsai, Chen-Shiun Lee","doi":"10.1109/ITC44778.2020.9325237","DOIUrl":null,"url":null,"abstract":"We propose a machine learning based method targeted for accurate wafer defect map classification. The proposed method is referred to as TestDNA-E, as it applies ensemble learning based on improved TestDNA features. Experimental results show that the proposed method achieves high hit rate for each defect type and overall accuracy.","PeriodicalId":251504,"journal":{"name":"2020 IEEE International Test Conference (ITC)","volume":"33 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2020-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 IEEE International Test Conference (ITC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ITC44778.2020.9325237","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2

Abstract

We propose a machine learning based method targeted for accurate wafer defect map classification. The proposed method is referred to as TestDNA-E, as it applies ensemble learning based on improved TestDNA features. Experimental results show that the proposed method achieves high hit rate for each defect type and overall accuracy.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
基于集成学习的晶圆缺陷特征模式识别
我们提出了一种基于机器学习的晶圆缺陷图精确分类方法。提出的方法被称为TestDNA- e,因为它应用了基于改进的TestDNA特征的集成学习。实验结果表明,该方法对各种缺陷类型都有较高的命中率和整体准确率。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Modeling Accuracy of Wideband Power Amplifiers with Memory effects via Measurements Automated Assertion Generation from Natural Language Specifications Characterization, Modeling and Test of Synthetic Anti-Ferromagnet Flip Defect in STT-MRAMs Fast Bring-Up of an AI SoC through IEEE 1687 Integrating Embedded TAPs and IEEE 1500 Interfaces Methods for Susceptibility Analysis of Logic Gates in the Presence of Single Event Transients
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1