A novel trench IGBT with a rectangular oxide beneath the trench gate

Jae In Lee, Jong-Won Choi, Young-seok Bae, M. Sung
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引用次数: 4

Abstract

General IGBTs are of two basic types, the planar IGBT and the trench IGBT. The trench IGBT has certain advantages when compared with the planar IGBT, such as a lower on-state voltage drop and a smaller cell pitch, but it also has a disadvantage in its lower breakdown voltage. The lower breakdown voltage is caused by the electric field being concentrated in a corner along the bottom of the trench gate. Therefore in this paper we propose a new trench IGBT structure that is designed to offer improved breakdown voltage.
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一种新型沟槽IGBT,沟槽栅极下有矩形氧化物
一般的IGBT有两种基本类型:平面IGBT和沟槽IGBT。与平面IGBT相比,沟槽IGBT具有更小的导通压降和更小的电池间距等优点,但其缺点是击穿电压较低。较低的击穿电压是由于电场集中在沿沟槽栅极底部的一个角落造成的。因此,在本文中我们提出了一种新的沟槽IGBT结构,旨在提供更高的击穿电压。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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