{"title":"Characterizing the impact of conductor surface roughness on CB-CPW behavior via reduced computational complexity","authors":"Arghya Sain, K. Melde","doi":"10.1109/EPEPS.2012.6457891","DOIUrl":null,"url":null,"abstract":"This paper presents a way to include the effects of conductor surface roughness in three-dimensional full wave simulation tools. A comparison of the computational load and attenuation coefficient as a function of the number and area of different surfaces roughened is given.","PeriodicalId":188377,"journal":{"name":"2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems","volume":"34 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2012-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEPS.2012.6457891","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3
Abstract
This paper presents a way to include the effects of conductor surface roughness in three-dimensional full wave simulation tools. A comparison of the computational load and attenuation coefficient as a function of the number and area of different surfaces roughened is given.
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