EDFAS Virtual Workshop Highlights

D. Grosjean
{"title":"EDFAS Virtual Workshop Highlights","authors":"D. Grosjean","doi":"10.31399/asm.edfa.2021-1.p050","DOIUrl":null,"url":null,"abstract":"\n This column provides commentary about the 2020 EDFAS Virtual Workshop. Highlights from the three days of online sessions include a keynote address on the history of MEMS, a panel discussion on 3D packaging technologies, and nearly 60 technical papers and posters. Workshop attendees also had the opportunity to walk through a virtual Expo Hall and learn about new analytical tools and techniques and interact with equipment vendors.","PeriodicalId":431761,"journal":{"name":"EDFA Technical Articles","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2021-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"EDFA Technical Articles","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.31399/asm.edfa.2021-1.p050","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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Abstract

This column provides commentary about the 2020 EDFAS Virtual Workshop. Highlights from the three days of online sessions include a keynote address on the history of MEMS, a panel discussion on 3D packaging technologies, and nearly 60 technical papers and posters. Workshop attendees also had the opportunity to walk through a virtual Expo Hall and learn about new analytical tools and techniques and interact with equipment vendors.
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EDFAS虚拟研讨会亮点
本专栏提供关于2020年EDFAS虚拟研讨会的评论。为期三天的在线会议的亮点包括关于MEMS历史的主题演讲,关于3D封装技术的小组讨论,以及近60篇技术论文和海报。与会者还将有机会参观虚拟展览厅,了解新的分析工具和技术,并与设备供应商进行互动。
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