Sangung Park, Jin-ho Yoon, Byoung Woong Moon, H. Jeong, Se Young Jeong, Seung Jae Lee, Kisu Joo
{"title":"Study on EMI Shielding at the PCB Strip Level with Conformal Spray Coating Process","authors":"Sangung Park, Jin-ho Yoon, Byoung Woong Moon, H. Jeong, Se Young Jeong, Seung Jae Lee, Kisu Joo","doi":"10.1109/ECTC32696.2021.00137","DOIUrl":null,"url":null,"abstract":"We demonstrated the new strip-level EMI shielding process with a spray method. Test PKGs having dimension of 300um width and l, 200um height were fabricated to evaluate feasibility of strip-level EMI shielding. As a result, spray can coat the total area of trench inner side wall with the special spray coating material and optimized spray parameters. Moreover, we measured the near-field shielding effectiveness(SE) of sputtering and spray films. 5.9um-thick sputtering one and 5.4um-thick Ag ink sprayed were prepared and measured in near E- and H-field in the range of 30MHz∼1.5GHz. In E-field, The SE results showed 21dB at 800MHz and 55dB at 100MHz. In H-field, the SE result of 5.4um-thick Ag ink was 1∼2dB higher than 5.9um-thick Sus/Cu/Sus film.","PeriodicalId":351817,"journal":{"name":"2021 IEEE 71st Electronic Components and Technology Conference (ECTC)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2021-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2021 IEEE 71st Electronic Components and Technology Conference (ECTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC32696.2021.00137","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
We demonstrated the new strip-level EMI shielding process with a spray method. Test PKGs having dimension of 300um width and l, 200um height were fabricated to evaluate feasibility of strip-level EMI shielding. As a result, spray can coat the total area of trench inner side wall with the special spray coating material and optimized spray parameters. Moreover, we measured the near-field shielding effectiveness(SE) of sputtering and spray films. 5.9um-thick sputtering one and 5.4um-thick Ag ink sprayed were prepared and measured in near E- and H-field in the range of 30MHz∼1.5GHz. In E-field, The SE results showed 21dB at 800MHz and 55dB at 100MHz. In H-field, the SE result of 5.4um-thick Ag ink was 1∼2dB higher than 5.9um-thick Sus/Cu/Sus film.
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