Epoxy encapsulation on Ceramic Quad Flat Packs

1994 Proceedings. 44th Electronic Components and Technology Conference Pub Date : 1994-05-01 DOI:10.1109/ECTC.1994.367617

T. Carden, J. Clementi, S. Engle

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引用次数: 7

Abstract

The Ceramic Quad Flat Pack (CQFP) is a high performance, low cost technology for surface mount applications. It is an extension of the Metallized Ceramic (MC) and Metallized Ceramic with Polyimide (MCP) product base. These finished modules conform to JEDEC I/O and footprint standards. The packages are available in 0.5 mm and 0.4 mm lead pitches with flexibility to address unique application requirements such as body sizes or lead counts/pitches. Semiconductor die interconnection is performed using either flip chip (C4-Controlled Collapse Chip Connection) attach or wirebonding. Excellent package reliability with no intrinsic wear out failure mechanism results by encapsulating solder joints from the silicon C4 die and peripheral lead to ceramic carrier. IBM evaluated several encapsulant configurations, and tested over 2000 encapsulated carriers and 897000 individual solder joints during development and qualification. Epoxy encapsulation of solder joint connections on CQFP's has been successfully implemented in production across several IBM manufacturing sites. This enhancement eliminates any intrinsic failure mechanism associated with fatigue wear out. It is a significant extension of a low cost and high reliability product technology.<>

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环氧树脂封装陶瓷四平面包装

陶瓷四平面封装(CQFP)是一种高性能、低成本的表面贴装应用技术。它是金属化陶瓷(MC)和聚酰亚胺金属化陶瓷(MCP)产品基础的延伸。这些成品模块符合JEDEC I/O和足迹标准。该封装有0.5 mm和0.4 mm引线间距，可灵活地满足独特的应用要求，如车身尺寸或引线数/间距。半导体芯片互连是使用倒装芯片(C4-Controlled Collapse chip Connection)连接或线键连接进行的。优异的封装可靠性和无内在磨损失效机制的结果是封装焊点从硅C4模具和外围引线到陶瓷载体。IBM评估了几种封装剂配置，并在开发和认证期间测试了超过2000个封装载体和897000个单独的焊点。CQFP的焊点连接的环氧封装已经成功地在多个IBM制造站点的生产中实现。这种增强消除了与疲劳磨损相关的任何内在失效机制。它是低成本、高可靠性产品技术的重要延伸。

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1994 Proceedings. 44th Electronic Components and Technology Conference

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