{"title":"Universal MEMS platforms for passive RF components: suspended inductors and variable capacitors","authors":"L. Fan, R.T. Chen, A. Nespola, M. Wu","doi":"10.1109/MEMSYS.1998.659724","DOIUrl":null,"url":null,"abstract":"We propose a universal MEMS technology platform for fabricating integrable passive components for radio frequency (RF) integrated circuits. This platform is based on a novel surface-micromachined Micro-Elevator by Self-Assembly (MESA) technique. Both high-Q inductors and variable capacitors can be realized by the MESA technology. A surface-micromachined spiral inductor that is raised by 250 /spl mu/m above the Si substrate has been experimentally demonstrated. The suspended inductor has less parasitic capacitance and substrate loss, and higher quality (Q) value and resonant frequency. The inductance of a 12.5-turn inductor is measured to be 24 nH. The results show that the self-assembled passive RF elements are suitable for monolithic integration.","PeriodicalId":340972,"journal":{"name":"Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176","volume":"74 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1998-01-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"38","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MEMSYS.1998.659724","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 38
Abstract
We propose a universal MEMS technology platform for fabricating integrable passive components for radio frequency (RF) integrated circuits. This platform is based on a novel surface-micromachined Micro-Elevator by Self-Assembly (MESA) technique. Both high-Q inductors and variable capacitors can be realized by the MESA technology. A surface-micromachined spiral inductor that is raised by 250 /spl mu/m above the Si substrate has been experimentally demonstrated. The suspended inductor has less parasitic capacitance and substrate loss, and higher quality (Q) value and resonant frequency. The inductance of a 12.5-turn inductor is measured to be 24 nH. The results show that the self-assembled passive RF elements are suitable for monolithic integration.