The Promise of Known-good-die Technologies

Abstract

The yield and reliability requirements for multichip packaging (MCP) applications have provided the major impetus for the development of known-good-die (KGD) technology solutions. KGD technology includes components of electrical contact, mechanical fixturing, IC design, test and automation. This paper will provide an overview of the KGD market and KGD technologies currently available in the industry. Die-Level-Burn-In (DLBI) approaches based on temporary bare die carriers are emerging in the industry. The goal for carrier development for test and burn-in is a cost-effective, bare die contact and fixturing approach that accommodates both peripheral and array contacts as well as wire bond and bumped die. For semiconductor manufacturers, possibility of conducting burn-in in wafer form is more attractive and holds the promise of reducing the total cost to manufacture die, regardless of the packaging destination. This paper will provide a review of KGD technology solutions which span a range of maturity from conceptual to qualified for production.