{"title":"Efficient Signal and Power Integrity Analysis Using Parallel Techniques","authors":"Tao Su, Xiaofeng Wang, Zhengang bai, V. Vennam","doi":"10.1109/EPEP.2007.4387172","DOIUrl":null,"url":null,"abstract":"This paper describes the application of parallel algorithms for analyzing the electronic packages and PCB's in a fast and efficient manner. The effectiveness of multithreading at various stages of the analysis has been illustrated. The application of distributed computation to further accelerate the solution process is demonstrated.","PeriodicalId":402571,"journal":{"name":"2007 IEEE Electrical Performance of Electronic Packaging","volume":"48 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2007-11-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2007 IEEE Electrical Performance of Electronic Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.2007.4387172","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
This paper describes the application of parallel algorithms for analyzing the electronic packages and PCB's in a fast and efficient manner. The effectiveness of multithreading at various stages of the analysis has been illustrated. The application of distributed computation to further accelerate the solution process is demonstrated.
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