Advanced architecture for achieving true vertical testability in next generation ATE

Abstract

Equivalent test results across maintenance levels have long been an elusive target for both military and commercial users. The fundamental reason for this is that it has been impractical to deploy the same ATE forward at the operations level as well as in support locations and/or depots. Forward deployed ATE tends to be based on requirements for ruggedness, transportability and a small footprint. In addition, it is usually targeted to support a small number of weapon system components. The other extreme is depot or factory ATE, with requirements for support of more weapon system components, and tending to have wider overall capability and a larger footprint. Because of the diverse size and packaging issues associated with the different environments, invariably, different ATE backplanes and instrument packaging formats are selected for each environment. Use of different instruments at each of the maintenance levels may lead to Can-Not-Duplicates (CNDs) at the depot test for electronic components pulled out of service based on test results of forward-deployed ATE. The goal of having test equivalence (eliminating CNDs) at the various levels is referred to as “Vertical Testability”.